H1B Salary Data
Companies
Job Titles
Cities
We use cookies to improve your experience and analyze site traffic.
Privacy Policy
Decline
Accept
Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer at Apple Inc $171,525 | H1B Salary Data
← Back to Search
H1B Record: I-200-24012-635648
Case Number
I-200-24012-635648
Case Status
Certified
Visa Class
H-1B
Employer
Apple Inc
Job Title
Embedded 5G/4G Cellular Physical Layer DSP Firmware Engineer
SOC Code
17-2072.00
· Electronics Engineers, Except Computer
Base Salary
$171,525
Range: $171,525 – $237,767
Prevailing Wage
$159,702
· IV
Full Time
Yes
Location
San Diego, CA
Year
2024
Submitted Date
2024-01-11
Start Date
2024-01-29
End Date
2027-01-28